Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces, High Performance Compute and System-in-Package, Wiley, John Wiley & Sons,Electronic devices and materials,Electronics engineering, Embedded technologies; fan-out wafer level packaging; panel level packaging; semiconductor applications; semiconductors for high performance computing; semiconductors for system-in-package; semiconductor miniaturization;, TSMC, ASE, Deca Technologies, M-Series, integrated fan-out.,, IEEE Press, United States, en-UShttps://www.wiley.comEmbedded technologies; fan-out wafer level packaging; panel level packaging; semiconductor applications; semiconductors for high performance computing; semiconductors for system-in-package; semiconductor miniaturization;, TSMC, ASE, Deca Technologies, M-Series, integrated fan-out., [BLURB],[CITY],,books, ebooks, biblet, Book2look