Progress in Adhesion and Adhesives, Volume 4, , Wiley, John Wiley & Sons,Materials science,Mechanical engineering and materials, thermal; p; critical review; interface; microelectronic; solder; adhesion phenomena; interconnects,, , United States, en-UShttps://www.wiley.comthermal; p; critical review; interface; microelectronic; solder; adhesion phenomena; interconnects, [BLURB],[CITY],,books, ebooks, biblet, Book2look